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| NEW High Speed, Matched-Impedance, Parallel Board-to-board Connector System IT1 Series Receptacle (2 required) IT1 Series Outline High-speed matched-impedance parallel board-to-board connector designed for applications requiring board-toboard spacing with transmission speeds exceeding 1GHz. The connection system has matched impedance of 50 ohm or can be customized. Contacts are on 0.5mm pitch. Transmission Module qConnection Cross-Sectional Diagram sFeatures 1. Impedance Matching using a 4-Layer Board The innovative transmission module uses PC boards with a strip line design of transmission lines, providing matched impedance of 50 ohms, for standard product. 2. Supports Multiple Connectors per board Designed with a tolerance of +/- 0.2mm for both the X and Y-axis. The three-piece structure and the +/- 0.2mm tolerance allows 3 or more IT1's to be mounted on a single board. (0.95) : Wipe Receptacle 2-Point contact 4-Layer board (Impedance matching) 3. Customized Board-to-Board Distance Board-to-board distance can be customized, from 16mm to 40mm. Ground lines or additional traces can be added to support high level, high speed transmission or mixed power/signal applications. Transmission Module (1.2): Wipe 2-Point contact 4. Signal to Ground Ratio The standard signal-to-ground ratio is 10:2, which makes reliable matching of the characteristic impedance of each transmission line. This ratio also can be customized. Receptacle 5. Contact Reliability Use of double contact points on each of the contacts assures highly reliable performance. sApplications Routers, servers, base stations and other telecommunication equipment. 2004.8 1 sProduct Specifications Rating Current rating Voltage rating 0.4 A (Note 1) 50V AC Operation Temperature Range -55c to +85c Storage Temperature -10c to +60c (Note 2) Range Storage Humidity Range 40% to 70% (Note 2) Operation Humidity Relative humidity 95% max. Range (No condensation) Item Specification Measured at 100V DC 150 V AC/one minute Measured at 100 mA Conditions 1. Insulation resistance 100 M ohms min. 2. Withstanding voltage No flashover or insulation breakdown 3. Contact resistance 100 m ohms max. 4. Vibration 5. Shock No electrical discontinuity of 1 s or more. No damage, cracks, or parts dislocation. No electrical discontinuity of 1 s. min. No damage, cracks, or parts dislocation Contact resistance: 110 m ohms max. Insulation resistance: 100 M ohms min. No damage, cracks, or parts dislocation Contact resistance: 110 m ohms max. Insulation resistance: 100 M ohms min. No damage, cracks, or parts dislocation Frequency of 10 to 55 Hz, 0.75mm single amplitude, for 10 cycles in each of 3 directions Acceleration of 490 m/s2, 11 ms duration, sine half-wave waveform, 3 cycles in each of the 3 axis. 96 hours/40c/ humidity of 90% to 95% Temperature: -55c/ +15c to +35c/ +85c/ +15c to +35c Duration: 30 / 2 to 3 / 30 / 2 to 3 (Minutes) 5 cycles 20 cycles Reflow: At the recommended temperature profile Manual soldering: 300c for 3 seconds 6. Humidity 7. Temperature cycle Contact resistance: 110 m ohms max. 8. Durability (insertion/ withdrawal) No damage, cracks, or parts dislocation. 9. Resistance to 9. Soldering Heat No deformation of components affecting performance. Note1: If the connector is going to be used at a current in excess of the 0.4 A, please contact your Sales Representative. Note2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation. Note3: Contact resistance is for the 19mm stacking height assemblies. sMaterial Receptacles Part Insulator Contacts Metal fittings Material LCP Phosphor bronze Phosphor bronze Finish Color : Beige Gold plating flash Tin plating Remarks UL94V-0 ------------------- Transmission Module Part Insulator Board Material PBT FR-4 Finish Color : Black Contact portion : Gold plating flash Remarks UL94V-0 ---------- sOrdering information Receptacles IT 1 # - * S - SV (* *) 1 2 3 4 5 6 Transmission Module IT 1 - * P / * - *H 1 1 Series name 2 Locating Post type Blank 3 4 7 5 Lead SV : Straight SMT 8 : IT1 : With Locating Post A : Without Locating Post : 168, 252 3 Number of contacts 4 Connector S : Receptacle Socket P : Transmission Plug Module 6 Packaging Blank : Tray (25) : Tray(connectors with attached tape for a vacuum board placement) 7 Number of ground contacts : 28, 44 8 Board-to-board Distance: 19mm,23mm,30mm 2 sReceptacles - 168 Contacts 20.5 (=0.541) 0.2 0.05 b84 A 1 1.5 0.5 1.5 0.5 20.5 (=0.541) b2 b1 8.8 0.5 ( 0.6) 6 0.5 2 0.2 (3.55) 2-(O1.5 mm): Locating Post b1 168 0.2 A a1 a84 A a2 a1 60.7 0.5 (52) 60.7 0.5 Part Number IT1-168S-SV IT1A-168S-SV CL No. 641-0002-0 641-0012-4 Locating Post Type With Locating Post Without Locating Post BRecommended PCB mounting pattern 61.7 +0.1 0 0 56.9 -0.1 52 0.05 20.5 ( =0.541) 0.3 0.02 b 84 168 1.5 0.5 1.5 0.5 20.5 ( =0.541) 3.55 0.05 0.06 A b2 b1 6.6 -0.1 3 +0.1 0 a 84 A a2 a1 1 2-O1.70.05 1 Not required for products without Locating Post. 9.4 +0.1 0 0 3 sReceptacles - 252 Contacts 20.5 (=0.541) b126 A 3 20.5 (=0.541) 1.5 0.5 1.5 0.5 20.5 (=0.541) b2 b1 C b1 1. 5 a1 0.2 0.05 252 0.2 A a126 a2 a1 84.2 0.5 ( 75.5 ) 84.2 0.5 ( 0.6 ) 6 0.5 2 0.2 A 8.8 0.5 ( 3.55 ) 2-(O1.5 mm): Locating Post Part Number IT1-252S-SV IT1A-252S-SV CL No. 641-0003-3 641-0013-7 Locating Post Type With Locating Post Without Locating Post BRecommended PCB mounting pattern 85.2 80.4 49.5 20.5 ( =0.541) 0.3 0.02 252 0.06 A b 126 B 3 +0.1 0 3 20.5 (=0.541) 1.5 0.5 . 1.5 0.5 3.55 b2 b1 +0.1 0 0 -0.1 26 20.5 (=0.541) 6.6 a 126 A a2 a1 1 2- O1.7 0.05 9.4 0.1 A.B 1 Not required for products without locating Post. 4 +0.1 0 0 -0.1 sTransmission Module - 168 Contacts b row 7.8 0.5 a row (4.2) 5.8 0.3 168 A 1 1 570.5 550.3 Mating side 8.4 0.3 8.4 0.3 19 Board Mounting side Locking Protrusion (2 Sides) 560.3 CL No. CL641-0192-8 CL641-0303-7 Part Number IT1-168P/28-19H IT1-168P/28-30H Board-to-board Distance 19mm 30mm A 18.4 13.9 B 18.4 13.9 5.8 0.3 6.6 0.5 C 16.6 17.6 sConnection Table The connection table indicates contact numbers in the mated condition,as illustrated in Fig. 1. Signal Ground Fig. 1 Signal Ground Signal Ground Signal Ground a row - a01 - a84 a02 - a83 a03 - a82 Signal a04 - a81 a05 - a80 a06 - a79 Ground a07 - a78 a08 - a77 i i i i i i Signal i i i i a17 - a68 a18 - a67 Ground a19 - a66 a20 - a65 i i i i i i Signal i i i i a29 - a56 a30 - a55 Ground a31 - a54 a32 - a53 i i i i i i Signal i i i i a41 - a44 a42 - a43 a43 - a42 - a44 - a41 i i i i i i i i i i a53 - a32 a54 - a31 a55 - a30 a56 - a29 i i i i i i i i i i a65 - a20 a66 - a19 a67 - a18 a68 - a17 i i i i i i i i i i a77 - a08 a78 - a07 a79 - a06 a80 - a05 a81 - a04 a82 - a03 a83 - a02 a84 - a01 Signal Ground Signal Ground Signal Ground Signal Ground b row - b01 - b84 b02 - b83 b03 - b82 Signal b04 - b81 b05 - b80 b06 - b79 Ground b07 - b78 b08 - b77 i i i i i i Signal i i i i b17 - b68 b18 - b67 Ground b19 - b66 b20 - b65 i i i i i i Signal i i i i b29 - b56 b30 - b55 Ground b31 - b54 b32 - b53 i i i i i i Signal i i i i b41 - b44 b42 - b43 b43 - b42 - b44 - b41 i i i i i i i i i i b53 - b32 b54 - b31 b55 - b30 b56 - b29 i i i i i i i i i i b65 - b20 b66 - b19 b67 - b18 b68 - b17 i i i i i i i i i i b77 - b08 b78 - b07 b79 - b06 b80 - b05 b81 - b04 b82 - b03 b83 - b02 b84 - b01 5 sTransmission Module - 252 Contacts q2-row type b row 7.80.5 a row (4.2) 5.80.3 252 A 2 1 80.5 0.5 78.5 0.3 Mating side 10.4 0.3 23 Board Mounting side Locking Protrusion (2 Sides) 79.5 0.3 10.4 0.3 CL No. CL641-0231-8 CL641-0304-0 Part Number IT1-252P/44-23H IT1-252P/44-30H Board-to-board Distance 23mm 30mm A 10.4 13.9 B 10.4 13.9 C 10.6 17.6 sConnection Table The connection table indicates contact numbers in the mated condition,as illustrated in Fig. 1. a row - a44 - a83 i i i i i i i i i i a53 - a74 a54 - a73 a55 - a72 a56 - a71 i i i i i i i i i i a62 - a65 a63 - a64 a64 - a63 a65 - a62 i i i i i i i i i i a71 - a56 a72 - a55 a73 - a54 a74 - a53 i i i i i i i i i i a83 - a44 a84 - a43 a85 - a42 b row - b44 - b83 i i i i i i i i i i b53 - b74 b54 - b73 b55 - b72 b56 - b71 i i i i i i i i i i b62 - b65 b63 - b64 b64 - b63 b65 - b62 i i i i i i i i i i b71 - b56 b72 - b55 b73 - b54 b74 - b53 i i i i i i i i i i b83 - b44 b84 - b43 b85 - b42 Signal Ground Signal Fig.1 Ground Signal Ground Signal Ground - a01 - a126 i i i i i i i i i i a05 - a122 a06 - a121 a07 - a120 a08 - a119 i i i i i i i i i i a17 - a110 a18 - a109 a19 - a108 a20 - a107 i i i i i i i i i i a29 - a98 a30 - a97 a31 - a96 a32 - a95 i i i i i i i i i i a41 - a86 a42 - a85 a43 - a84 Signal Signal Ground Ground Signal Signal Ground Ground Signal Signal Ground Ground Signal Signal - a86 - a41 i i i i i i i i i i a95 - a32 a96 - a31 a97 - a30 a98 - a29 i i i i i i i i i i a107 - a20 a108 - a19 a109 - a18 a110 - a17 i i i i i i i i i i a119 - a08 a120 - a07 a121 - a06 a122 - a05 i i i i i i i i i i a126 - a01 Signal Ground Signal Ground Signal Ground Signal Ground Ground - b01 - b126 i i i i i i i i i i b05 - b122 b06 - b121 b07 - b120 b08 - b119 i i i i i i i i i i b17 - b110 b18 - b109 b19 - b108 b20 - b107 i i i i i i i i i i b29 - b98 b30 - b97 b31 - b96 b32 - b95 i i i i i i i i i i b41 - b86 b42 - b85 b43 - b84 Signal Signal Ground Ground Signal Signal Ground Ground Signal Signal Ground Ground Signal Signal - b86 - b41 i i i i i i i i i i b95 - b32 b96 - b31 b97 - b30 b98 - b29 i i i i i i i i i i b107 - b20 b108 - b19 b109 - b18 b110 - b17 i i i i i i i i i i b119 - b08 b120 - b07 b121 - b06 b122 - b05 i i i i i i i i i i b126 - b01 Ground 6 5.80.3 10.6 0.5 BIT1 Series Extraction Tool (6) (6) Part Number IT1-PICKER(1) CL No. 641-1001-3 Remarks 2-piece Package (1.25) (O2.5) (3) (42) 7 Installation and Use Instruction Manual Table of Contents 1. System Components ................................................................ 9 Receptacles Transmission Module Assembly Extraction Tool 2. Recommended Design Guidelines ..................................... 10 2-1 Recommended Solder Land Pattern 2-2 Board-to-Board Spacer Heights 3. Connector Placement ............................................................. 11 3-1 Receptacle Packaging Types 3-2 Receptacle Vacuum Pick-and-Place Areas 3-3 Receptacle Board Placement 3-4 Recommended Reflow Conditions 3-5 Solder Repairs 4. Mating Procedure ..................................................................... 14 5. Un-mating of Connectors ...................................................... 15 6. Removal of the Transmission Module from the stationary side. ..16 7. Precautions When Mounting Multiple Connectors ...... 17 Allowable Amount of Misalignment Recommended Positional Location 8 BConnector Handling Precautions 1. System components sReceptacles Contacts Row A and row B contacts are arranged alternately starting with No.1 in row B. Placement on board is polarized. Metal Fittings Permanently inserted to provide lock with the Transmission Module and additional solder areas with the PCB. Insulator body. Injection molded single unit provides protection and correct self-alignment of all components. Insulator body Even numbered row: A contacts Odd numbered row: B contacts Metal fittings sTransmission Module Assembly Each Module has stationary side and a mating/un-mating side. When mounting multiple connectors, please keep uniform orientation of the stationary side. Transmission printed circuit boards used in the module are based on JIS standards and quality standards applicable to memory modules. Guide frame Transmission boards. Mating/ un-mating side (Short) Stationary side (Longer) sExtraction Tool Used to release the transmission module from the stationary receptacle. Extraction Tool (2 required) Fully Connected Condition The interconnection package consists of 3 main sub-assemblies: Two receptacles and the Transmission Module. The transmission module, held securely by the guide frame has a mating/un-mating side and a stationary side. Once the stationary side is inserted in the receptacle, it can not be removed without the use of extraction tool. The mating/un-mating side allows repeated re-insertion of the receptacle on this side only. Receptacles Mating/ unmating side Transmission module assembly Stationary side 9 2. Recommended Design Guidelines 2-1 Solder Land Pattern When placing the receptacles on the Printed Circuit Boards using automatic mounting equipment or manually, assure that the correct diameters of the holes (Fig. 1) are through the entire thickness of the board. SLocating post hole diameterS The contacts of receptacle assembly are exposed on the bottom surfaces. The exposed areas of the contacts are a distance of 0.25 mm minimum from the surface of the Printed Circuit Board, on which the receptacle assembly is placed (Fig.2). Consideration should be taken not to place or assure insulation of conductive traces under the receptacle assemblies. Refer to the separate drawings for recommended solder land pattern dimensions of the receptacle, and signals and ground connection diagram of the transmission module. Fig. 1 IT1-168S-SV Recommended Solder Land Pattern (mm) Automatic placement / (Locating post hole diameter) C dimension: 1.7 mm Manual placement / (Locating post hole diameter) C dimension: 1.6 mm / A position accuracy of + 0.03 should be exercised from the center of the hole to contact Number 84. Fig. 2 2-2 Board-to-Board Spacer heights The two parallel boards connected by the IT1 connectors should be fastened to additional spacers between them. Fig. 3 indicates the connector height tolerance and the spacer's height. When designing the spacer's height, consideration should be given to the solder paste thickness and any other features, which may affect the full mating of the connector. Fig. 3 indicates design dimensions for the 19 mm board-to-board distance. Fig. 3 (mm) 10 3. Connector Placement 3-1 Packaging Types Two types of packaging are available: semi-hard tray and hard tray. Customers may specify a packaging type suitable for their automatic placement machines. * Refer to the separate drawings for the detailed dimensions of the trays. Semi-hard tray packaging 168 contacts receptacle: 40 pieces per tray 252 contacts receptacle: 30 pieces per tray (mm) Hard tray packaging 168 contacts receptacle: 24 pieces per tray 252 contacts receptacle: 16 pieces per tray 3-2 Automatic placement - Vacuum Pick-and-Place Areas Specify "Vacuum Pick-up Tape Specification". The area and position of the pick-and-place surface are indicated in the diagrams below. (mm) 11 3-3 Receptacle Board Placement When using automatic placement equipment, verify the packaging type and the Pick-and-place areas. When placing manually, pay attention to the possibility of positional shift. Ref. Fig. 4. * When placing multiple connectors, to assure positional accuracy, it is advised to use automatic placement equipment. SPrecautions for Manual PlacementS The orientation posts serve as a prevention measure to avoid incorrect placement of the receptacle assemblies on the board. The contact terminals must be placed correctly over the corresponding solder pad as shown on Fig. 4-1. Fig. 4-1 = Correct Fig. 4-2 = Incorrect Fig. 4-3 = Incorrect 3-4 Recommended Reflow Conditions 12 3-5 Solder Repairs Assure that flux is not reaching the contact areas of the connector. Wash the assembly as recommended below. SCleaning ConditionsS 13 4. Mating Procedure Follow the procedure described below. Note:The transmission module must be fully inserted into receptacle assembly already placed and soldered to a board. The Transmission Module cannot be exposed to heat temperatures of the soldering process. Step 1 Receptacle Placement on the board - stationary side Assure that the orientation posts are aligned with the holes on the board. When specifying receptacle assemblies without the orientation posts exercise extra caution to assure correct orientation and connection with the solder pads. Step 2 Insertion of the Transmission Module Fully insert the Transmission Module in the board-installed receptacle assembly. It is critical that the insertion is done straight and uniformly. Step 3 Mating/un-mating Assure that the receptacle assembly is correctly aligned with the Transmission Module. Fully insert the receptacle assembly on the Transmission Module. It is critical that the insertion is done straight and uniformly. Step 4 Connection completed 14 5. Un-mating of Connectors Recommended Method Pull uniformly straight up. Prohibited un-mating Methods 15 6. Removal of the Transmission Module - stationary side Requires use of dedicated extraction tool. Two are required. Step 1 Fully insert the tools into each end of the receptacle assembly (Fig. 1) assuring that they will be over the hold areas of the Transmission Module frame. Ref. Fig. 2 Fig. 1 Step 2 Pull out the transmission module holding the tools straight. Fig. 2 extraction tool Insertion Area Insertion area Inappropriate area 16 7. Precautions When Mounting Multiple Connectors Note: Observe the requirements as listed in paragraph 7-1 and 7-2. The mating/un-mating forces will increase with use of multiple assemblies. It is recommended that a dedicated tooling is used for mating / un-mating of multiple connector assemblies in a single operation. 7-1 Allowable Amount of Misalignment Maximum allowable misalignment in X and Y directions is 0.2 mm total. Refer to the drawings below. Length Orientation X1-X2= + 0.2 - Width Orientation Y1-Y2= + 0.2 - 7-2 Recommended Connector Placement It is recommended to leave min. of 30 mm space between the adjacent connector assemblies. 7-3 Examples of Prohibited Placement Positions To assure reliability of solder joints and mating/ un-mating without damage, DO NOT PLACE MULTIPLE CONNECTORS as illustrated below. 17 |
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